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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/28434
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dc.contributor.authorVrublevsky, I. A.-
dc.contributor.authorChernyakova, E. V.-
dc.contributor.authorVidekov, V. H.-
dc.contributor.authorTuchkovsky, A. K.-
dc.contributor.authorDinh, T.-
dc.date.accessioned2017-12-08T12:08:00Z-
dc.date.available2017-12-08T12:08:00Z-
dc.date.issued2017-
dc.identifier.citationUtilization of circuit boards on aluminum with nanoporous anodic alumina and copper layer for power modules in switching power supplies / I. Vrublevsky and others // Nanoscience & Nanotechnology, 17,№ 2 / eds. E. Balabanova, E. Mileva. - Sofia, 2017. - P. 40 - 43.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/28434-
dc.description.abstractThe paper presents the results of the studies on thermal efficiency of printed circuit board based on aluminum with nanoporous anodic alumina layer. It was showed that thermal efficiency of aluminum circuit board 0.6 thick with a layer of nanoporous anodic alumina 20 µm thick was close the thermal efficiency of aluminum oxide ceramic 0.6 thick. The example of use of an aluminum base with a layer of nanoporous anodic alumina for fabrication of the power module of switching power supply is described.ru_RU
dc.language.isoenru_RU
dc.subjectпубликации ученыхru_RU
dc.subjectaluminum baseru_RU
dc.subjectprinted circuit boardru_RU
dc.subjectnanoporous anodic aluminaru_RU
dc.subjectpower electronicsru_RU
dc.subjectthermal imaging cameraru_RU
dc.titleUtilization of circuit boards on aluminum with nanoporous anodic alumina and copper layer for power modules in switching power suppliesru_RU
dc.typeСтатьяru_RU
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