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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/38480
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dc.contributor.authorLanin, V. L.-
dc.contributor.authorNiyakouski, A. A.-
dc.date.accessioned2020-02-05T05:43:32Z-
dc.date.available2020-02-05T05:43:32Z-
dc.date.issued2019-
dc.identifier.citationLanin, V. L. Solderability assessment of galvanic coatings in electronics / V. L. Lanin, A. A. Niyakouski // Current Topics in Electrochemistry. – 2019. – Vol. 21. – P. 83 – 92.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/38480-
dc.description.abstractThe problem of providing high-quality soldered joints during the assembly and installation of electronic products draws attention to the use of effective methods for controlling the solderabil-ity of electronic components and func-tional coatings of parts. The solderabil-ity of electroplated coatings used in electronics was studied by two meth-ods: evaluating the spreading of a dosed drop of solder and the wetting force by molten solder. The criteria for evaluating the solderability of coatings are systematized and refined.ru_RU
dc.language.isoenru_RU
dc.publisherResearch Trends (P) Ltd.ru_RU
dc.subjectпубликации ученыхru_RU
dc.subjectsolderabilityru_RU
dc.subjectgalvanic coatingsru_RU
dc.subjectwettabilityru_RU
dc.subjectsolder drop heightru_RU
dc.titleSolderability assessment of galvanic coatings in electronicsru_RU
dc.typeСтатьяru_RU
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