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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/53757
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dc.contributor.authorLanin, V. L.-
dc.contributor.authorPetuhov, I. B.-
dc.contributor.authorRetyukhin, G. E.-
dc.coverage.spatialUSAen_US
dc.date.accessioned2023-12-05T07:05:17Z-
dc.date.available2023-12-05T07:05:17Z-
dc.date.issued2023-
dc.identifier.citationLanin, V. L. Hole Formation in Semiconductor Materials by Laser Microprocessing / V. L. Lanin, I. B. Petuhov, G. E. Retyukhin // Surface engineering and applied electrochemistry. – 2023. – Vol. 59, № 4. – P. 523–528.en_US
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/53757-
dc.description.abstractThe process of laser formation of microholes in semiconductor substrates using an EM-4452-1 laser-processing unit with a pulse repetition frequency of a picosecond laser from 10 to 300 kHz at a radiation energy up to 10 μJ is investigated. The combination of high-speed movements of the laser beam by the galvanoscanner system and precise positioning of the processed material increases the efficiency of laser microprocessing and expands the functional capabilities of the equipment.en_US
dc.language.isoenen_US
dc.publisherAllerton Pressen_US
dc.subjectпубликации ученыхen_US
dc.subjectlaser radiationen_US
dc.subjectholesen_US
dc.subjectsemiconductor substratesen_US
dc.subjectmicroprocessingen_US
dc.titleHole Formation in Semiconductor Materials by Laser Microprocessingen_US
dc.typeArticleen_US
dc.identifier.DOI10.3103/S1068375523040075-
Appears in Collections:Публикации в зарубежных изданиях

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