Modeling and Control of the Parameters of Ultrasonic Transducer for Connecting Wire Outputs

Abstract

The methods of modelling and control parameters of the ultrasonic piezoelectric transducers used for wire bonding in the electronic devices are investigated. It is established, that resonance frequencies of ultrasonic transducer may be with different mechanical oscillation modes. It was found that the matching of the piezoelectric driver and the horn in the mode of longitudinal mechanical vibrations at the resonance frequency helps to achieve the maximum quality of the wire bonding. Technological tests carried out confirm this statement.