| DC Field | Value | Language |
|---|
| dc.contributor.author | Lanin, V. L. | - |
| dc.date.accessioned | 2017-11-14T09:43:02Z | - |
| dc.date.available | 2017-11-14T09:43:02Z | - |
| dc.date.issued | 2001 | - |
| dc.identifier.citation | Lanin, V. L. Ultrasonic soldering in electronics / V. L. Lanin // Ultrasonics Sonochemistry. – 2001. – N 8. – P. 379 – 385. | ru_RU |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/27706 | - |
| dc.description.abstract | Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows to use lead-free solders. Methods of ultrasonic solder melt activation, lead-free solders in (US) and glassceramic capacitor metallization processes have been investigated. | ru_RU |
| dc.language.iso | en | ru_RU |
| dc.publisher | ELSEVIER SCIENCE | ru_RU |
| dc.subject | публикации ученых | ru_RU |
| dc.subject | Soldering | ru_RU |
| dc.subject | Ultrasonics | ru_RU |
| dc.subject | Electronic Components | ru_RU |
| dc.title | Ultrasonic soldering in electronics | ru_RU |
| dc.type | Статья | ru_RU |
| Appears in Collections: | Публикации в зарубежных изданиях
|
