DC Field | Value | Language |
dc.contributor.author | Vrublevsky, I. A. | - |
dc.contributor.author | Chernyakova, E. V. | - |
dc.contributor.author | Videkov, V. H. | - |
dc.contributor.author | Tuchkovsky, A. K. | - |
dc.contributor.author | Dinh, T. | - |
dc.date.accessioned | 2017-12-08T12:08:00Z | - |
dc.date.available | 2017-12-08T12:08:00Z | - |
dc.date.issued | 2017 | - |
dc.identifier.citation | Utilization of circuit boards on aluminum with nanoporous anodic alumina and copper layer for power modules in switching power supplies / I. Vrublevsky and others // Nanoscience & Nanotechnology, 17,№ 2 / eds. E. Balabanova, E. Mileva. - Sofia, 2017. - P. 40 - 43. | ru_RU |
dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/28434 | - |
dc.description.abstract | The paper presents the results of the studies on thermal efficiency of printed circuit board based on aluminum with nanoporous anodic alumina layer. It was showed that thermal efficiency of aluminum circuit board 0.6 thick with a layer of nanoporous anodic alumina 20 µm thick was close the thermal efficiency of aluminum oxide ceramic 0.6 thick. The example of use of an aluminum base with a layer of nanoporous anodic alumina for fabrication of the power module of switching power supply is described. | ru_RU |
dc.language.iso | en | ru_RU |
dc.subject | публикации ученых | ru_RU |
dc.subject | aluminum base | ru_RU |
dc.subject | printed circuit board | ru_RU |
dc.subject | nanoporous anodic alumina | ru_RU |
dc.subject | power electronics | ru_RU |
dc.subject | thermal imaging camera | ru_RU |
dc.title | Utilization of circuit boards on aluminum with nanoporous anodic alumina and copper layer for power modules in switching power supplies | ru_RU |
dc.type | Статья | ru_RU |
Appears in Collections: | Публикации в зарубежных изданиях
|