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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/28807
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dc.contributor.authorSolodukha, V. A.-
dc.contributor.authorShvedov, S. V.-
dc.contributor.authorChyhir, R. R.-
dc.contributor.authorPetlitsky, A. N.-
dc.contributor.authorPetlitskaya, T. V.-
dc.date.accessioned2017-12-20T08:17:49Z-
dc.date.available2017-12-20T08:17:49Z-
dc.date.issued2017-
dc.identifier.citationDepth Measurement of the Nano-dimensional Surface Damages of the Silicon Wafers in Production of the Submicron Integrated Circuits / V. A. Solodukha and other // 10th International Conference «New Electrical and Electronic Technologies and their Industrial Implementation» (June 27 – 30, 2017). – Zakopane. – Р. 25.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/28807-
dc.language.isoenru_RU
dc.publisherZakopaneru_RU
dc.subjectпубликации ученыхru_RU
dc.titleDepth Measurement of the Nano-dimensional Surface Damages of the Silicon Wafers in Production of the Submicron Integrated Circuitsru_RU
dc.typeСтатьяru_RU
Appears in Collections:Публикации в зарубежных изданиях

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