DC Field | Value | Language |
dc.contributor.author | Shulgov, V. V. | - |
dc.date.accessioned | 2018-01-15T11:41:46Z | - |
dc.date.available | 2018-01-15T11:41:46Z | - |
dc.date.issued | 2017 | - |
dc.identifier.citation | Shulgov, V. The Increase in Thermal Stability of Anodic Alumina Films on Aluminum / V. Shulgov // Book of Abstracts the 5th International Conference Oxide Materials for Electronic Engineering – fabrication, properties and application (ОМЕЕ-2017). – Р. 39. | ru_RU |
dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/29246 | - |
dc.description.abstract | Thermal stability of porous anodic alumina formed in various electrolytes is discussed. The bending deflection of the samples measured was converted to thermal stress. A model of transformation of the pore morphology during the re-anodizing in the electrolyte at the voltage increased relative to the voltage of the primary anodization is proposed. | ru_RU |
dc.language.iso | en | ru_RU |
dc.publisher | Видавництво Львівської політехніки | ru_RU |
dc.subject | публикации ученых | ru_RU |
dc.subject | aluminum | ru_RU |
dc.subject | aluminum alloy | ru_RU |
dc.subject | anodic alumina | ru_RU |
dc.subject | crack | ru_RU |
dc.subject | heat resistance | ru_RU |
dc.title | The Increase in Thermal Stability of Anodic Alumina Films on Aluminum | ru_RU |
dc.type | Статья | ru_RU |
Appears in Collections: | Публикации в зарубежных изданиях
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