| DC Field | Value | Language |
|---|
| dc.date.accessioned | 2019-03-20T12:03:14Z | - |
| dc.date.available | 2019-03-20T12:03:14Z | - |
| dc.date.issued | 2010 | - |
| dc.identifier.citation | Lanin, V. L. Ultrasonic soldering in electronics: new opportunities / V. L. Lanin // Solid State Electrochemistry / Ed. By T. G. Willard: N.Y.: NOVA Publ. - 2010. – P. 201–211. | ru_RU |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/34781 | - |
| dc.description.abstract | Interest to processes flux-free ultrasonic soldering and tinning details and conclusions of electronic components is caused by transition on lead-free solders and environmental problems of the soldering in electronics. To formation of qualitative connections with metal and nonmetallic materials apply methods and devices of local ultra-sonic activation solder melts. | ru_RU |
| dc.language.iso | en | ru_RU |
| dc.publisher | NOVA Publ. | ru_RU |
| dc.subject | публикации ученых | ru_RU |
| dc.subject | Ultrasonic | ru_RU |
| dc.subject | Soldering | ru_RU |
| dc.subject | Electronics | ru_RU |
| dc.subject | Flux-free | ru_RU |
| dc.subject | Connections | ru_RU |
| dc.title | Ultrasonic Soldering in Electronics: New Opportunities | ru_RU |
| dc.type | Глава из книги | ru_RU |
| Appears in Collections: | Публикации в зарубежных изданиях
|
