| DC Field | Value | Language |
|---|
| dc.contributor.author | Lanin, V. L. | - |
| dc.date.accessioned | 2019-04-03T09:18:25Z | - |
| dc.date.available | 2019-04-03T09:18:25Z | - |
| dc.date.issued | 2012 | - |
| dc.identifier.citation | Lanin, V. L. High-Frequency Heating for Soldering in Electronics / Vladimir L. Lanin // Circuits and Systems. – 2012. – № 3. – P. 238-241. | ru_RU |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/34913 | - |
| dc.description.abstract | Processes of high-frequency (HF) heating are considered and its parameters for the soldering of electronic modules are optimized. The advantages of HF heating: selectivity by skin-effect; high density of energy; processing in any environment, including vacuum or inert gas; high ecological cleanliness, improvement solder flowing by electrodynamics forces increase the quality of soldering connections. Investigation of HF electromagnetic heating has allowed to optimize heating speed in local zones of soldering connections formation and to improve their quality due to joint action of superficial effects and electromagnetic forces. | ru_RU |
| dc.language.iso | en | ru_RU |
| dc.publisher | Scientific Research Publishing | ru_RU |
| dc.subject | публикации ученых | ru_RU |
| dc.subject | high-frequency | ru_RU |
| dc.subject | inductor | ru_RU |
| dc.subject | soldering | ru_RU |
| dc.subject | electronic modules | ru_RU |
| dc.title | High-Frequency Heating for Soldering in Electronics | ru_RU |
| dc.type | Статья | ru_RU |
| Appears in Collections: | Публикации в зарубежных изданиях
|
