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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/42946
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dc.contributor.authorMuratova, E. N.-
dc.contributor.authorMoshnikov, V. A.-
dc.contributor.authorVrublevsky, I. A.-
dc.contributor.authorChernyakova, E. V.-
dc.contributor.authorPetlitsky, A. N.-
dc.contributor.authorLushpa, N. V.-
dc.date.accessioned2021-02-11T12:29:26Z-
dc.date.available2021-02-11T12:29:26Z-
dc.date.issued2020-
dc.identifier.citationThermal Flows in a PCB from Aluminum with Alumina Oxide Generated by a Linear Heat Source / E. Muratova [et. al.] // New Materials : Preparation, Properties and Applications in the Aspect of Nanotechnology / A. G. Syrkov, K. L. Levine [editor]. – USA : Nova Science Publishers, 2020. – Chapter 12. – P. 115–123.ru_RU
dc.identifier.urihttps://libeldoc.bsuir.by/handle/123456789/42946-
dc.description.abstractThe paper presents the results of study heat fluxes in a plate made of aluminum with nanoporous aluminum oxide generated by a linear heat source. A carbon filament was used as heating element. It was established that the heat distribution had the form of a heat pipe cone. This effect leads to a decrease in thermal resistance of the printed circuit board.ru_RU
dc.language.isoenru_RU
dc.publisherNova Science Publishersru_RU
dc.subjectпубликации ученыхru_RU
dc.subjectnanoporous aluminum oxideru_RU
dc.subjectthermal fluxesru_RU
dc.subjectthermogramru_RU
dc.titleThermal Flows in a PCB from Aluminum with Alumina Oxide Generated by a Linear Heat Sourceru_RU
dc.typeГлава из книгиru_RU
Appears in Collections:Публикации в зарубежных изданиях

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