| DC Field | Value | Language |
|---|
| dc.contributor.author | Petuhov, I. | - |
| dc.contributor.author | Lanin, V. | - |
| dc.coverage.spatial | Australia | en_US |
| dc.date.accessioned | 2023-11-17T08:15:49Z | - |
| dc.date.available | 2023-11-17T08:15:49Z | - |
| dc.date.issued | 2022 | - |
| dc.identifier.citation | Petuhov, I. New Generation Semi-Automatic Thermosonic Wire Bonder / I. Petuhov, V. Lanin // Journal of Electronic Research and Application – 2022. – Vol. 6, issue 6. – P. 1–8. | en_US |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/53674 | - |
| dc.description.abstract | The physical and technological aspects of wire ball-wedge bonding in the assembly of integrated circuits are considered. The video camera and the pattern recognition system (PRS) of new bonder helps to provide accurate positioning of the bonding tool on the chip pads of integrated circuits. The formation of the loop wire cycle is ensured by synchronous movement of bonding head along Z axis and the working table along XY axes based on the servo drive. A feature of bonder is that it can bond all the wire loops of electronic device according to pre-recorded program without needing to align the bonding points. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Bio-Byword Scientific Publishing | en_US |
| dc.subject | публикации ученых | en_US |
| dc.subject | high frequency ultrasonic | en_US |
| dc.subject | ball formation | en_US |
| dc.subject | gold wire bonding | en_US |
| dc.subject | bonding tool | en_US |
| dc.title | New Generation Semi-Automatic Thermosonic Wire Bonder | en_US |
| dc.type | Article | en_US |
| dc.identifier.DOI | DOI: 10.26689/jera.v6i6.4564 | - |
| Appears in Collections: | Публикации в зарубежных изданиях
|
