| DC Field | Value | Language |
|---|
| dc.contributor.author | Khatskevich, A. | - |
| dc.contributor.author | Lanin, V. | - |
| dc.coverage.spatial | Almaty | en_US |
| dc.date.accessioned | 2023-12-05T06:56:51Z | - |
| dc.date.available | 2023-12-05T06:56:51Z | - |
| dc.date.issued | 2023 | - |
| dc.identifier.citation | Khatskevich, A. Modeling local induction heating of solder balls for flip-chip mounting in COMSOL Multiphysics / A. Khatskevich, V. Lanin // Proceedings of VI International Science ang Practical Conference Science and Technology, 2023 / Endless Light in Science. – Almaty. – P. 364–368. | en_US |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/53756 | - |
| dc.description.abstract | For Flip-chip mounting, it is necessary to form contact bumps for 2.5D and 3D electronic modules. Exposure to the energy of high-frequency (HF) electromagnetic oscillations allows for high-performance non-contact heating in various processes for soldering electronic components. This paper presents studies of temperature fields during induction heating of solder balls with several types of copper concentrators made in the COMSOL MULTIPHYSICS software. The dependences of frequency of inductor on heating time and geometric shapes of copper concentrators on quality of the soldered sample were revealed. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Endless Light in Science | en_US |
| dc.subject | публикации ученых | en_US |
| dc.subject | Flip-Chip | en_US |
| dc.subject | 3D modules | en_US |
| dc.subject | COMSOL Multiphysics | en_US |
| dc.subject | Induction heating | en_US |
| dc.subject | Solder bumps | en_US |
| dc.title | Modeling local induction heating of solder balls for flip-chip mounting in COMSOL Multiphysics | en_US |
| dc.type | Article | en_US |
| dc.identifier.DOI | DOI 10.24412/2709-1201-2023-364-368 | - |
| Appears in Collections: | Публикации в зарубежных изданиях
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