Modeling of the liquid cooling system for high-power elements of technical means

Abstract

The article evaluates the efficiency of a liquid cooling system designed for highpower components of modern computing systems, including the central processing unit (CPU), memory chips, and graphics processing unit (GPU). To achieve this, a detailed three-dimensional model of a personal stationary computer was developed using the Solid Edge (Siemens) software environment. The study employed the FloEFD (Flow Simulation) module to simulate hydrodynamics and heat transfer processes, enabling accurate analysis of thermal performance. Key parameters such as ambient temperature (ranging from 263 K (-10 °C) to 313 K (40 °C)), type of refrigerant (water (H2O), EK-CryoFuel, and Koolance LIQ-702), and the number of operational fans (one to three) were systematically investigated to determine their impact on cooling efficiency. The results provide insights into optimizing liquid cooling systems under varying environmental and operational conditions, offering valuable guidance for improving thermal management in high-performance computing environments. This research highlights the importance of considering multiple factors when designing efficient cooling solutions for advanced technical systems.