| DC Field | Value | Language |
|---|
| dc.contributor.author | Sokol, V. | - |
| dc.contributor.author | Shulgov, V. V. | - |
| dc.date.accessioned | 2016-05-13T11:06:02Z | - |
| dc.date.accessioned | 2017-07-27T12:27:08Z | - |
| dc.date.available | 2016-05-13T11:06:02Z | - |
| dc.date.available | 2017-07-27T12:27:08Z | - |
| dc.date.issued | 2015 | - |
| dc.identifier.citation | Sokol, V. Thermal stability of anodic layers on aluminum alloys abstract / V. Sokol, V. Shulgov // Solid State Phenomena. – 2015. – Vol. 230. – P. 14–18. | ru_RU |
| dc.identifier.uri | https://libeldoc.bsuir.by/handle/123456789/6765 | - |
| dc.description.abstract | The thermal stability of anodic alumina layers made by the open circuit potential measurements and electron microscopy is discussed. The crack growth resistance of the anodic alumina layers has been studied depending on the initial aluminum alloy composition and the anodization regimes. | ru_RU |
| dc.language.iso | en | ru_RU |
| dc.publisher | Solid State Phenomena | ru_RU |
| dc.subject | публикации ученых | ru_RU |
| dc.subject | aluminum alloys | ru_RU |
| dc.subject | aluminum | ru_RU |
| dc.subject | anodic alumina | ru_RU |
| dc.subject | crack | ru_RU |
| dc.subject | heat resistance | ru_RU |
| dc.title | Thermal stability of anodic layers on aluminum alloys abstract | ru_RU |
| dc.type | Article | ru_RU |
| dc.identifier.DOI | https://doi.org/10.4028/www.scientific.net/SSP.230.14 | - |
| Appears in Collections: | Публикации в зарубежных изданиях
|
