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Browsing by Author Lanin, V.

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Showing results 1 to 2 of 2
Issue DateTitleAuthor(s)
2023Modeling local induction heating of solder balls for flip-chip mounting in COMSOL MultiphysicsKhatskevich, A.; Lanin, V.
2022New Generation Semi-Automatic Thermosonic Wire BonderPetuhov, I.; Lanin, V.