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Browsing by Author Lanin, V.

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Issue Date	Title	Author(s)
2023	Modeling local induction heating of solder balls for flip-chip mounting in COMSOL Multiphysics	Khatskevich, A.; Lanin, V.
2022	New Generation Semi-Automatic Thermosonic Wire Bonder	Petuhov, I.; Lanin, V.

Showing results 1 to 2 of 2