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Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/28371
Title: Investigation of the efficiency of the heat dissipation for the heat-conducting circuit boards made of aluminum with the nanoporous alumina layer
Authors: Andreev, S.
Chernyakova, E. V.
Tzaneva, B.
Videkov, V. H.
Vrublevsky, I. A.
Keywords: публикации ученых;printed circuits;aluminum;heating systems;temperature measurement;conductivity;thermal conductivity;carbon
Issue Date: 2017
Publisher: IEEE Xplore Digital Library
Citation: Investigation of the efficiency of the heat dissipation for the heat-conducting circuit boards made of aluminum with the nanoporous alumina layer / S. Andreev and others // 40th International Spring Seminar on Electronics Technology (ISSE). – Sofia : IEEE Xplore Digital Library, 2017. - Рp. 1-6. - doi: 10.1109/ISSE.2017.8000899.
Abstract: The results of the investigation of the efficiency of the heat dissipation from the circuit board made of aluminum with the nanoporous alumina layer and conducting copper layer. In the construction of these circuit boards nanoporous alumina was used as insulator, which provided heat transfer from topology elements to the aluminum substrate. The conducting copper layer was formed by electroplating followed by chemical deposition of thin nickel layer. The diode MBRB16H60 was used as an element possessing high level of heat release. The temperature on the surface of the circuit board was measured by the thermocouple and the infrared images of the samples were studied by the thermal imaging camera. It was shown that proposed circuit boards allow significantly increasing the efficiency of the heat dissipation from the circuit board elements and reducing their operating temperature. The thermal conductivity of the nanoporous anodic alumina layer was determined to be 1.56 W K-1 m-1.
URI: https://libeldoc.bsuir.by/handle/123456789/28371
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