https://libeldoc.bsuir.by/handle/123456789/43869| Title: | Simulation of the complex impact of thermal and shock loads on electronic modules |
| Other Titles: | Моделирование комплексного воздействия тепловых и ударных нагрузок на электронные модули |
| Authors: | Bavbel, E. I. Alekseev, V. F. Piskun, G. A. |
| Keywords: | публикации ученых;thermal shock;shock loads;electronic modules |
| Issue Date: | 2020 |
| Publisher: | Севастопольский государственный университет |
| Citation: | Bavbel, E. I. Simulation of the complex impact of thermal and shock loads on electronic modules / E. I. Bavbel, V. F. Alekseev, G. A. Piskun // Современные проблемы радиоэлектроники и телекоммуникаций : сб. науч. тр. / Севастопольский государственный университет ; редкол.: А. А. Савочкин [и др.]. – Севастополь, 2020. – № 3. – С. 176. |
| Abstract: | A technique for the optimal design of electronic modules is proposed. At the same time, the methodology is based on the system principles of the analysis of complex systems, complex modeling of physical processes in electronic modules and finding optimal solutions. |
| URI: | https://libeldoc.bsuir.by/handle/123456789/43869 |
| Appears in Collections: | Публикации в зарубежных изданиях |
| File | Description | Size | Format | |
|---|---|---|---|---|
| Bavbel_Simulation1.pdf | 1.37 MB | Adobe PDF | View/Open |
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