https://libeldoc.bsuir.by/handle/123456789/49244| Title: | Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates |
| Authors: | Vorobjova, A. I. Labunov, V. A. Outkina, E. A. Khodin, A. A. Sycheva, O. A. Ezovitova, T. I. |
| Keywords: | публикации ученых;differential thermal analysis;scanning electron microscopy |
| Issue Date: | 2022 |
| Publisher: | Springer |
| Citation: | Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates / A. I. Vorobjova [et al.] // Russian Microelectronics. – 2022. – Vol. 51. – P. 282-294. – DOI : https://doi.org/10.1007/s00542-022-05335-3. |
| Abstract: | The results of a comprehensive study of the structural- morphological and thermodynamic characteristics of the electrochemical precipitation of Cu in transition holes with a barrier layer of TiN in Si/SiO2 substrates by scanning electron microscopy (SEM) and differential thermal analysis (DTA) are presented. The temperature range that determines the heat resistance of copper (up to 750°C) and the temperature range (up to 886°C) that determines the thermal stability of the composite as a whole, as well as the ability to maintain the chemical composition and ordered structure at elevated temperatures, are found. |
| URI: | https://libeldoc.bsuir.by/handle/123456789/49244 |
| Appears in Collections: | Публикации в зарубежных изданиях |
| File | Description | Size | Format | |
|---|---|---|---|---|
| Vorobjova_Study.pdf | 74.49 kB | Adobe PDF | View/Open |
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