Materials for Building Electrical Connections

Abstract

Particular emphasis is placed on the challenges associated with the use of lead-free soldering materials. A promising avenue of exploration lies in the utilization of water-based fluxes and flux gels. Water-based fluxes containing surfactant additives offer notable advantages, particularly in their application via spray mechanisms. They exhibit robust stability and mitigate thermal shock occurrences during soldering operations. The chapter also examines the primary types of mounting microwires employed in ultrasonic and thermosonic microwelding processes, alongside outlining the role of protective liquids in the cleaning of connections.