The future of micro – and nanoelectronics

Abstract

The article examines the future development of micro– and nanoelectronics in the context of the approaching physical and economic limits of Moore’s Law. Key emerging technologies are analyzed, including two-dimensional materials (in particular InSe and 2D metals), neuromorphic computing, spintronics, three-dimensional heterogeneous integration (CFET, Forksheet) and advanced packaging solutions. The study highlights current challenges such as power consumption, heat dissipation and manufacturing scalability, while demonstrating how these innovations (including TSMC/Intel 2-nm processes 2025–2026 and wafer-scale InSe transistors) open new opportunities in artificial intelligence, quantum computing, energy-efficient systems and biomedical devices. It is shown that the transition to “beyond-CMOS” paradigms, supported by interdisciplinary research and international collaboration, will ensure transformative advances in electronics, increasing performance, sustainability and accessibility of next-generation devices.