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Browsing by Author Lanin, V. L.

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Issue DateTitleAuthor(s)
2010Activation of Melts by the Energy of Ultrasonic and Infrared FieldsLanin, V. L.
2017Application of Concentrated Electromagnetic Energy Streams in Electronics ManufacturingLanin, V. L.
2024Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and EquipmentLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 10. High-Frequency Soldering Technology in ElectronicsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 11. Laser Soldering of Electronic ModulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 12: Microassembly of Integrated Circuits and MicromodulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 13. Sealing of Integrated Circuits and MicroblocksLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 14. Interblock Mounting of Electronic EquipmentLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 15: Quality Control of Assembly and MountingLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 2. Materials for Building Electrical ConnectionsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 3. Solderability of Materials and Electronic ComponentsLanin, V. L.; Emel’yanov, V. A.; Petuhov, I. B.
2024Chapter 4. Physicochemical Foundations of Electric Mounting SolderingLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 5. Assembly and Mounting of Electronic Modules on Printed Circuit BoardsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 6. Surface Mount Assembly of Electronic ModulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 7. Technology for the Assembly and Mounting of MicromodulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 8. Assembly and Mounting of Microwave Micromodules and MicroblocksLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 9. Ultrasonic Soldering and Metallization in ElectronicsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2017Comparative effectiveness of infrared heat sources for mounting and dismounting electronic modulesLanin, V. L.; Lappo, A. I.
2025Constructing Method of an Ultra-sonic System of Thermosonic Bonding Installation Using the Ball–Wedge TechniqueLanin, V. L.; Petukhov, I. B.
2020Effects of Induction Heating in Air Gap of Magnetic WireLanin, V. L.; Ratnikau, E. S.; Hatskevich, A. D.