Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment

Abstract

This chapter explores the evolving trends in contemporary electronic module designs and assembly technologies. The enhancement of computer technology and digital communication tools, coupled with the escalation in the operational speed of the elemental base, hinges directly on the reduction of signal transmission length between logical elements, i.e., the constructive delay of the transmitted signal. Interconnection technology, crucial for bridging the microcosm of semiconductor chips with the external world of electronic devices, emerges as pivotal for producing viable products. We provide a comprehensive classification and discussion of assembly connection designs, employing methods involving direct material contact under the influence of pressure, heat, and physical impact in various combinations. Intermediate materials such as solder, microwires, and conductive adhesives are utilized in these processes. Special emphasis is placed on surface mounting of electronic components, COB assembly technology, Flip Chip, BGA, and the assembly of multichip electronic modules.