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Browsing by Author Emel’yanov, V. A.

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Showing results 1 to 12 of 12
Issue DateTitleAuthor(s)
2024Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and EquipmentLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 10. High-Frequency Soldering Technology in ElectronicsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 11. Laser Soldering of Electronic ModulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 12: Microassembly of Integrated Circuits and MicromodulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 13. Sealing of Integrated Circuits and MicroblocksLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 14. Interblock Mounting of Electronic EquipmentLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 15: Quality Control of Assembly and MountingLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 2. Materials for Building Electrical ConnectionsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 6. Surface Mount Assembly of Electronic ModulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 7. Technology for the Assembly and Mounting of MicromodulesLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 8. Assembly and Mounting of Microwave Micromodules and MicroblocksLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
2024Chapter 9. Ultrasonic Soldering and Metallization in ElectronicsLanin, V. L.; Emel’yanov, V. A.; Petukhov, I. B.
Showing results 1 to 12 of 12