Please use this identifier to cite or link to this item:
https://libeldoc.bsuir.by/handle/123456789/27706
| Title: | Ultrasonic soldering in electronics |
| Authors: | Lanin, V. L. |
| Keywords: | публикации ученых;Soldering;Ultrasonics;Electronic Components |
| Issue Date: | 2001 |
| Publisher: | ELSEVIER SCIENCE |
| Citation: | Lanin, V. L. Ultrasonic soldering in electronics / V. L. Lanin // Ultrasonics Sonochemistry. – 2001. – N 8. – P. 379–385. |
| Abstract: | Ultrasonic (US) soldering of electronic components, as an alternative to flux soldering, is environmentally friendly, improves the quality of soldered connections at the mounting elements after long-term storage, and allows to use lead-free solders. Methods of ultrasonic solder melt activation, lead-free solders in (US) and glassceramic capacitor metallization processes have been investigated. |
| URI: | https://libeldoc.bsuir.by/handle/123456789/27706 |
| Appears in Collections: | Публикации в зарубежных изданиях
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