Please use this identifier to cite or link to this item:
https://libeldoc.bsuir.by/handle/123456789/29246
| Title: | The Increase in Thermal Stability of Anodic Alumina Films on Aluminum |
| Authors: | Shulgov, V. V. |
| Keywords: | публикации ученых;aluminum;aluminum alloy;anodic alumina;crack;heat resistance |
| Issue Date: | 2017 |
| Publisher: | Видавництво Львівської політехніки |
| Citation: | Shulgov, V. The Increase in Thermal Stability of Anodic Alumina Films on Aluminum / V. Shulgov // Book of Abstracts the 5th International Conference Oxide Materials for Electronic Engineering – fabrication, properties and application (ОМЕЕ-2017). – Р. 39. |
| Abstract: | Thermal stability of porous anodic alumina formed in various electrolytes is discussed. The bending deflection of the samples measured was converted to thermal stress. A model of transformation of the pore morphology during the re-anodizing in the electrolyte at the voltage increased relative to the voltage of the primary anodization is proposed. |
| URI: | https://libeldoc.bsuir.by/handle/123456789/29246 |
| Appears in Collections: | Публикации в зарубежных изданиях
|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
