Skip navigation
Please use this identifier to cite or link to this item: https://libeldoc.bsuir.by/handle/123456789/33941
Title: Thermal-Conductive Boards Based on Aluminum with an Al2O3 Nanostructured Layer for Products of Power Electronics
Authors: Muratova, E. N.
Moshnikov, V. A.
Luchinin, V. V.
Bobkov, A. A.
Vrublevsky, I. A.
Chernyakova, E. V.
Terukov, E. I.
Keywords: публикации ученых;thermal characteristics;nanostructured layer
Issue Date: 2018
Publisher: Pleiades Publishing
Citation: Thermal-Conductive Boards Based on Aluminum with an Al2O3 Nanostructured Layer for Products of Power Electronics / E. N. Muratova and other // Technical Physics. – 2018. – Vol 63, № 11. – P. 1626 – 1628. – DOI: 10.1134/S1063784218110191.
Abstract: The experimental results of electrical and thermal characteristics of circuit boards based on aluminum with a nanostructured layer of anodic aluminum oxide and copper conductors for assembling highpower field-effect transistors have been considered. It has been shown that the presence of a thin dielectric layer and thick aluminum base with high thermal conductivity provides a uniform distribution of heat generated by the active element over the entire volume of the board without formation of local regions with increased temperature. The experimental results have shown that the temperature gradient between the heat source and anodic aluminum oxide surface is about 17–18°C at a surface heat power of 4.4 W/cm2.
URI: https://libeldoc.bsuir.by/handle/123456789/33941
Appears in Collections:Публикации в зарубежных изданиях

Files in This Item:
File Description SizeFormat 
Muratova_Thermal.PDF239.49 kBAdobe PDFView/Open
Show full item record


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.