Please use this identifier to cite or link to this item:
https://libeldoc.bsuir.by/handle/123456789/34781
| Title: | Ultrasonic Soldering in Electronics: New Opportunities |
| Keywords: | публикации ученых;Ultrasonic;Soldering;Electronics;Flux-free;Connections |
| Issue Date: | 2010 |
| Publisher: | NOVA Publ. |
| Citation: | Lanin, V. L. Ultrasonic soldering in electronics: new opportunities / V. L. Lanin // Solid State Electrochemistry / Ed. By T. G. Willard: N.Y.: NOVA Publ. - 2010. – P. 201–211. |
| Abstract: | Interest to processes flux-free ultrasonic soldering and tinning details and conclusions of electronic components is caused by transition on lead-free solders and environmental problems of the soldering in electronics. To formation of qualitative connections with metal and nonmetallic materials apply methods and devices of local ultra-sonic activation solder melts. |
| URI: | https://libeldoc.bsuir.by/handle/123456789/34781 |
| Appears in Collections: | Публикации в зарубежных изданиях
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