| Issue Date | Title | Author(s) |
| 2022 | A Study of Ta2O5 Nanopillars with Ni Tips Prepared by Porous Anodic Alumina Through-Mask Anodization | Vorobjova, A. I.; Tishkevich, D. I.; Outkina, E. A.; Shimanovich, D. L.; Razanau, I. U.; Zubar, T. I.; Bondaruk, A. A.; Zheleznova, E. K.; Mengge Dong; Aloraini, D. A.; Sayyed, M. I.; Almuqrin, A. H.; Silibin, M. V.; Trukhanov, S. V.; Trukhanov, A. V. |
| 2024 | Fabrication of composite nanostructures for impedance biosensors using anodic aluminum oxide templates and carbon nanotubes | Vorobjova, A. I.; Tishkevich, D. I.; Outkina, E. A.; Yuan Yao; Razanau, I. U.; Zubar, T. I.; Rotkovich, A. A.; Bondaruk, A. A.; Sayyed, M. I.; Trukhanov, S. V.; Kubasov, I. V.; Fedosyuk, V. M.; Trukhanov, A. V. |
| 2020 | Graded bandgap nanostructured SnS-based photocells | Outkina, E. A.; Vorobyova, A. I.; Khodin, A. A. |
| 2018 | Highly ordered through-holes Porous alumina membranes for Ni-Fe nanowires fabrication | Vorobyova, A. I.; Shimanovich, D. L.; Outkina, E. A.; Khodin, A. A. |
| 2022 | Local electrochemical deposition of Ni into vertical vias in Si/SiO2 substrate | Vorobjova, A. I.; Labunov, V. A.; Outkina, E. A.; Khodin, A. A. |
| 2021 | Metallization of Vias in Silicon Wafers to Produce Three-Dimensional Microstructures | Vorobjova, A. I.; Labunov, V. A.; Outkina, E. A.; Grapov, D. V. |
| 2016 | Nickel/alumina nanocomposites by AC electrochemical processing | Vorobyova, A. I.; Outkina, E. A.; Khodin, A. A. |
| 2016 | Nickel/alumina nanocomposites by AC electrochemical processing | Vorobjova, A. I.; Outkina, E. A.; Khodin, A. A. |
| 2016 | Properties of Ni and Ni–Fe nanowires electrochemically deposited into a porous alumina template | Vorobjova, A. I.; Shimanovich, D. L.; Yanushkevich, K. I.; Prischepa, S. L.; Outkina, E. A. |
| 2017 | SnSx-based nanostructured layers for solar cells | Outkina, E. A.; Vorobyova, A. I.; Khodin, A. A. |
| 2013 | Study of metal pillar nanostructure formation with thin porous alumina template | Vorobyova, A. I.; Outkina, E. A.; Komar, O. M. |
| 2022 | Study of the Thermal Stability of Copper Contact Junctions in Si/SiO2 Substrates | Vorobjova, A. I.; Labunov, V. A.; Outkina, E. A.; Khodin, A. A.; Sycheva, O. A.; Ezovitova, T. I. |
| 2013 | Vortex matching effects in Nb thin films due to Ni nanopillars embedded in anodic aluminum oxide substrates | Trezza, M.; Cirillo, C.; Vorobjova, A. I.; Outkina, E. A.; Prischepa, S. L.; Attanasio, C. |
